AD7699BCPZ-Dispositivos analógicos originales (ADI)
AD7699BCPZ-Dispositivos analógicos originales (ADI)
$45.00 $43.50
$45.00 $43.50
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Descripción
AD7699BCPZ device is an AD conversion chip developed by ADI Company. This type of chip is mainly used for data processing purposes. The excellent performance of the AD7699BCPZ makes it the device of choice in the field of data processing. xt-shenzhen supplies all world-renowned semiconductor companies, and the sources of goods are original sources from formal channels. xt-shenzhen welcomes your inquiry! ! !
los AD7699BCPZ device is an 8-channel, 16-bit charge redistribution successive approximation register (SAR) analog-to-digital converter (ADC) that operates from a single supply, VDD. Contains all components for a multi-channel, low-power data acquisition system, including a true 16-bit SAR ADC with no missing codes;
The AD7699BCPZ uses a simple serial port interface (SPI) to write configuration registers and receive conversion results. The SPI interface uses a separate power supply VIO. Set to host logic levels, power consumption is proportional to throughput.
●16-bit resolution, no missing codes 8-channel multiplexer,
●Selectable input Unipolar single-ended differential (GND detection) pseudo-bipolar
●Single 5V supply with 1.8V to 5V logic interface
●External (up to VDD) internal temperature sensor
●Channel sequencer, selectable 1-pole filter, busy indicator No pipeline delay, SAR architecture
●Single 5V supply with 1.8V to 5V logic interface
●Standby current: 50 n / A 20
Tensión de alimentación (corriente continua) | 4.50V (min) |
Número de circuitos | 1 |
número de canales | 8 |
Número de pines | 20 |
número de dígitos | 16 |
Potencia disipada | 28 mW |
Sampling Rate | 500 ksps |
power consumption | 28 mW |
Resolution(Bits) | 16.0 |
Analog-to-digital conversion (ADC) | 1 |
número de entradas | 8 |
Temperatura de funcionamiento | -40℃ ~ 85 ℃ |
Potencia disipada(máx.) | 32 mW |
Tensión de alimentación (máx.) | 5.5V |
Tensión de alimentación (mínimo) | 4.5V |
metodo de instalacion | Montaje superficial |
encapsulación | LFCSP-20 |
Embalaje | Bandeja |
aplicación de fabricación | System Monitoring, Gestión de energía, Automation & Process Control, Procesamiento de la señal, Procesamiento de la señal, System Monitoring, Comunicaciones & Redes, Sensing and Instrumentation, Medical, Communication and Networking, Sensación & Instrumentation, Gestión de energía, Medical, Automation and Process Control |