Dispositivos analógicos originais AD7699BCPZ (ADI)
Dispositivos analógicos originais AD7699BCPZ (ADI)
$45.00 $43.50
$45.00 $43.50
- Descrição
- Investigação
Descrição
AD7699BCPZ device is an AD conversion chip developed by ADI Company. This type of chip is mainly used for data processing purposes. The excellent performance of the AD7699BCPZ makes it the device of choice in the field of data processing. xt-shenzhen supplies all world-renowned semiconductor companies, and the sources of goods are original sources from formal channels. xt-shenzhen welcomes your inquiry! ! !
o AD7699BCPZ device is an 8-channel, 16-bit charge redistribution successive approximation register (SAR) analog-to-digital converter (ADC) that operates from a single supply, VDD. Contains all components for a multi-channel, low-power data acquisition system, including a true 16-bit SAR ADC with no missing codes;
The AD7699BCPZ uses a simple serial port interface (IPS) to write configuration registers and receive conversion results. The SPI interface uses a separate power supply VIO. Set to host logic levels, power consumption is proportional to throughput.
●16-bit resolution, no missing codes 8-channel multiplexer,
●Selectable input Unipolar single-ended differential (GND detection) pseudo-bipolar
●Single 5V supply with 1.8V to 5V logic interface
●External (up to VDD) internal temperature sensor
●Channel sequencer, selectable 1-pole filter, busy indicator No pipeline delay, SAR architecture
●Single 5V supply with 1.8V to 5V logic interface
●Standby current: 50 nA 20
Tensão da fonte de alimentação (CC) | 4.50V (min) |
Number of circuits | 1 |
número de canais | 8 |
Número de pinos | 20 |
número de dígitos | 16 |
Poder dissipado | 28 mW |
Sampling Rate | 500 ksps |
power consumption | 28 mW |
Resolution(Bits) | 16.0 |
Conversão analógico-digital (ADC) | 1 |
número de entradas | 8 |
Temperatura de operação | -40℃ ~ 85 ℃ |
Poder dissipado(Máx.) | 32 mW |
Tensão da fonte de alimentação (Máx.) | 5.5V |
Tensão da fonte de alimentação (Mín.) | 4.5V |
método de instalação | Montagem em superfície |
encapsulamento | LFCSP-20 |
Embalagem | Bandeja |
aplicação de fabricação | System Monitoring, Gerenciamento de energia, Automation & Process Control, Signal Processing, Signal Processing, System Monitoring, Communications & Networking, Sensing and Instrumentation, Medical, Communication and Networking, Sensing & Instrumentation, Gerenciamento de energia, Medical, Automation and Process Control |