XC3S1400A-4FTG256C 자일링스

XC3S1400A-4FTG256C 자일링스

XC3S1400A-4FTG256C 자일링스

재고

설명

XT-ShenZhen introduces the XC3S1400A-4FTG256C device to you! The XC3S1400A-4FTG256C device is part of the Xilinx Spartan®-3A family. The Spartan®-3A family of Field Programmable Gate Arrays (FPGAs) solve most design challenges. Due to its extremely low cost, the XC3S1400A-4FTG256C device is ideal for a wide range of consumer electronics applications. We always aim at customer satisfaction! Helping customers to solve problems is our business purpose, 우리는 이내에 회신 할 것입니다 24 hours to every question raised by customers!

그만큼 XC3S1400A-4FTG256C device integrates a core processor with a frequency of up to 250MHz and a RAM size of up to 73728B.
The XC3S1400A-4FTG256C device features a very low-cost but high-performance logic solution: dual-range VCCAUX power supply simplifies 3.3V-only designs, suspend, sleep mode to reduce system power, low-cost Xilinx® platform flash with JTAG, multi-voltage , Multi-Standard Select™ interface pins, 까지 502 I/O pins or 227 differential signal pairs, LVCMOS, LVTTL, HSTL and SSTL single-ended I/O, 3.3V, 2.5V, 1.8V, 1.5V and 1.2 V signal, selectable output driver, 까지 24 mA per pin, QUIETIO standard reduces I/O switching noise, full 3.3V ±10% compatibility and hot-plug compliance, 640 per differential I/O +Mb/s data transfer rate.
The Spartan-3A family to which the XC3S1400A-4FTG256C device belongs is the best replacement for mask programming ASICs. FPGAs avoid lengthy development cycles, high initial costs, and allow design upgrades in the field.

• Enhanced Double Data Rate (DDR) support
• DDR/DDR2 SDRAM supports up to 400 Mb/s
• Fully compliant with 32/64-bit, 33/66 MHz PCI® technology support
• Rich and flexible logic resources
• Fast look-ahead carry logic
• IEEE 1149.1/1532 JTAG programming/debugging port
• Hierarchical Selector RAM™ memory architecture
• Efficient distributed RAM up to 176 kbit
• Low cost, space saving SPI serial flash PROM
• x8 or x8/x16 BPI parallel NOR flash PROM
• Load multiple bitstreams under FPGA control
• MicroFuture™ and Peel Lentil™ embedded processors
• Low-cost QFP and BGA packages, lead-free options
• Common footprint supports easy density migration
• Compatible with select Spartan-3AN non-volatile FPGAs
• Compatible with high density Spartan-3A DSP FPGA

빈도250 메가헤르츠
RAM 크기73728 비
논리 게이트 수1400000
전압1.14V ~ 1.26V
설치 방법표면 실장
핀 수256
패키지LBGA-256
작동 온도0℃ ~ 85℃ (TJ)

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