STM32F407ZGT6 STMicroelectronics
$7.90
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설명
As the world’s leading MCU manufacturer, ST’s products have always been favored by electronics manufacturers. 그 중, the STM32F407ZGT6 device is one of the most in-demand MCUs. It uses a high-performance ARM® Cortex™ M4 microcontroller to integrate innovative peripherals and is a powerful low-power device. xt-shenzhen has been providing customers with original quality electronic components. If you want to know or buy various original chips, 문의하시기 바랍니다! ! !
STM32F407ZGT6 is STMicroelectronics‘ STM32 F4 series high-performance MCU based on ARM Cortex-M4. It has DSP and FPU instructions and is an extension of STM32 series with higher performance. Having a 32-bit flash MCU with floating point unit (FPU) 디지털 신호 처리 (DSP) instructions and memory protection unit (MPU) greatly improves application security. The low-power application design makes the STM32F407ZGT6 suitable for various applications, including motor drive and application control, 산업용 애플리케이션: inverters, PLCs, scanners, 공조, video intercoms, home audio equipment and medical equipment.
- 핵심: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive Real-Time Accelerator (ART Accelerator™), allows 0-wait-state execution from Flash, frequency up to 168 메가헤르츠, Memory Protection Unit, 210DMIPS/1.25 DMIPS/MHz (드라이스톤 2.1) and DSP instructions
- LCD parallel interface, 8080/6800 방법
- Clock, reset and power management
– 1.8 V ~ 3.6 V application power and I/O
– POR, PDR, PVD and BOR
– 4 에게 26 MHz crystal oscillator
– Internal 16 MHz 공장 트리밍 RC (1% 정확성)
– 32 보정이 있는 RTC용 kHz 발진기
– Internal 32 kHz RC(교정 포함)
- 저전력 작동
– Sleep, 정지 및 대기 모드
– VBAT power supply for RTC, 20×32-bit backup registers + 선택 과목 4 KB 백업 SRAM
- Debug mode
– Serial Wire Debug (SWD) 및 JTAG 인터페이스
– Cortex-M4 Embedded Trace Macrocell™
빈도 | 168메가헤르츠 |
전원 전압 (DC) | 1.80V (분) |
작동 전압 | 1.8전압 ~ 3.6V |
핀 수 | 144 |
클록 주파수 | 168메가헤르츠 |
RAM 크기 | 196KB |
자릿수 | 32 |
플래시 메모리 용량 | 1024KB |
아날로그에서 디지털로의 변환 (ADC) | 3 |
입력/출력 수 | 114 입력 |
작동 온도 | -40℃ ~ 85℃ (깃 달기) |
디지털에서 아날로그로의 변환 (DAC) | 1 |
설치 방법 | 표면 실장 |
패키지 | LQFP-144 |
포장 | 쟁반 |