MBRS360T3G-ON Semiconductor

MBRS360T3G-ON Semiconductor

MBRS360T3G-ON Semiconductor

$1.23

In magazzino

$1.23

Descrizione

The electronic components produced by ON Semiconductor have always been very popular in the market. Tra loro, the MBRS360T3G device is one of the Schottky diodes, and the device meets the requirements of MSL1. It is an automotive grade material suitable for automotive applications. xt-shenzhen company has been strictly controlling the quality to supply electronic components to global customers, and is your trustworthy partner! ! !

IL MBRS360T3G is used in automotive and other applications requiring unique site and control change requirements. The Schottky barrier principle is used in large area metal silicon power diodes. The most advanced geometries have epitaxial structures with oxide passivation and metal capped contacts. Ideal for low voltage, high frequency rectification or as freewheeling and polarity protection diodes, small compact surface mount package with J-Bend leads.

• Rectangular package for automated handling
• Highly stable oxide passivated junction
• Excellent ability to withstand reverse avalanche energy transients
• Protective ring for stress protection
•AEC−Q101 Qualified and PPAP Capable
• These are the lead-free device mechanical characteristics
• Housing: Epoxy, molded, epoxy per UL 94 v-0
• Weight: 217 mg (approx.), SMC95 mg (approx.), SMB
• Finish: All exterior surfaces are corrosion resistant and terminal leads are easily solderable
• Lead wire and mounting surface temperature for soldering purposes: 260°C max. lasts 10 seconds
• Polarity: Notch in plastic body indicates cathode lead

Rated voltage (DC)60.0v
rated current3.00UN
Halogen free stateHalogen Free
Corrente di uscita≤3.00A
load current3UN
Numero di pin2
Forward Voltage740mV @3A
polaritàStandard
thermal resistance11℃/W (RθJL)
forward current3UN
Maximum Forward Surge Current (Ifsm)80UN
Forward voltage (Massimo)740mV
Forward current (Massimo)4UN
Temperatura di esercizio-65°C ~ 175°C
metodo di installazioneMontaggio superficiale
incapsulamentoDO-214AB
ImballaggioNastro & Bobina (TR)
applicazione di produzionePortable Devices, Settore automobilistico, Attrezzatura portatile, Industry, Power Management, Industriale, Portable Devices, , Elettronica di consumo, Settore automobilistico, Power Management, Industriale, Power Management, Elettronica di consumo

    SKU: 32000
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