Driven by intelligence, the automotive industry is expected to achieve industrial transformation and upgrading, and accelerate its entry into a new era of Internet of Everything + Intelligent Connection of Everything. Currently facing a new industrial upgrade from the information age to the intelligent age, the whole process can be compared to a functional machine to an intelligent machine.
Automotive smart terminals will become the nerve endings in the smart age, and automotive chips are the core of helping cars enter the smart age. From the perception of the physical world to the expression of the physical world, four basic competencies are required: connectivity, perception, expression, and computation. These four capabilities require a large number of chips to support implementation.
In the military field, advanced weapons and equipment, command information systems, and chips are even more indispensable. For example, acquisition chips can make weapons and equipment have “clairvoyance” and “smooth ears”, information processing chips can install “intelligent brains” on weapons and equipment, communication chips can connect various equipment and combat units for system confrontation, and memory chips can save each A variety of battlefield data for combat effectiveness and damage assessment, etc.
Military semiconductors are the key to realizing equipment informatization. On the one hand, it is necessary to develop towards an intelligent and unmanned direction.
Medical devices are adopting and increasingly adopting various semiconductor technologies to provide new functions and capabilities in smaller form factors. Along the way, they’re taking advantage of ever-increasing processing power, lower power consumption, and new types of sensors to drive healthcare forward.
Many different chip types have been used in medical devices over the years, many developed on older process nodes. They are now being combined with or replaced by new chips, many of which contain some level of artificial intelligence or machine learning.